Services
- Control of wafers' surfaces.
- Gashing or dicing of wafers.
- Plasma stripping.
- Thermo vacuum treatment.
- Heat treatment in controlled gas environment.
- Heat treatment in air.
- Chip bonding through sticking
- Chip bonding through eutectic soft soldering.
- Chip bonding with bulk leads through flip chip thermal-compression bonding.
- Bonding in wedge-wedge/ball-wedge mode.
- Rectangular packages bonding in inert ambient though electrocontact seam welding.
- Sealing control by mass spectrometer method.
- X-ray control.
- Free particles control in internal volume by acoustic method.
- Weld strength control for liftoff and offset.
- Thermo cycling.
- Control of electrical parameters of crystals within wafers in normal conditions and high temperatures.
- Control of electrical parameters of microchips in normal conditions and critical temperatures.