Crystal processing equipment

Substrate washing, photoresist coating (spin and aerosol) and development (EVG, Austria)

Contact photolithography and matching plant (SUSS, Germany)

Chemical etching of silicon wafers section – equipment (CSR, Czech Republic)

Diffusion furnace (SVCS, Czech Republic)

Cluster plant of plasma chemical etching (SPTS, UK)

Cluster plant of deposition (SEGI, USA)