Equipment
IC testing machine Ultraflex
Machine serves to control electrical and functional parameters of ICs. Performance capability:
- up to 300 ICs per hour using automatic sorting program;
- up to 1000 chips using automatic probe station.
Probing machine UF200A/AL
Machine serves to control electrical and functional parameters of chips as part of wafers in combination with testing machine.
Performance capability:
X-ray microscope XD7600NT.
Microscope serves for X-ray inspection of production.
Performance capability:
- Work field: 450х510х50 mm.
- Elevation angle: 600 from normal line.
Automatic dicing saw DAD3350.
Machine serves for gashing or dicing of wafers by diamond disk cutting.
Performance capability:
- Level of automation – semiautomated machine.
- Wafers diameter: 100, 125, 150, 200 mm.
- Electrospindle efficiency: 1800 watt.
- Cutting tool: 2” diamond disk.
Wire bonder-Base 64000G5.
Machine serves for forming of IC integral connection with thin aluminum wire by ultrasonic welding in wedge-wedge mode.
Performance capability:
The automatic and semi-auto Wedge/Wedge Bonder 5630.
Machine serves for forming of IC integral connection with thin aluminum/gold wire by ultrasonic and thermosonic welding in wedge-wedge mode; for weld strength control through liftoff.
Performance capability:
Line of IC packages sealing in inert ambient through seam welding with integrated vacuum furnace HPS9206M.
Machine serves for rectangular packages bonding in inert ambient though electrocontact seam welding with thermo vacuum pretreatment.
Performance capability: