Июль 2017
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Вакансии

Equipment

IC testing machine Ultraflex

flex.png Machine serves to control electrical and functional parameters of ICs. Performance capability:

  • Number of electric power supplies: 20.
  • Number of digital pipes: 256.
  • Number of analog generators: 2.
  • Performance capacity (Depends on test program complexity):
    - up to 300 ICs per hour using automatic sorting program;
    - up to 1000 chips using automatic probe station.
  • Probing machine UF200A/AL

    flex.png Machine serves to control electrical and functional parameters of chips as part of wafers in combination with testing machine.

    Performance capability:

  • Wafers diameter: 100, 125, 150, 200 mm.
  • Level of automation – total automaton .
  • X-ray microscope XD7600NT.

    7600.png Microscope serves for X-ray inspection of production.
    Performance capability:

    • Work field: 450х510х50 mm.
    • Elevation angle: 600 from normal line.

    Automatic dicing saw DAD3350.

    DAD3350.png Machine serves for gashing or dicing of wafers by diamond disk cutting.
    Performance capability:

    • Level of automation – semiautomated machine.
    • Wafers diameter: 100, 125, 150, 200 mm.
    • Electrospindle efficiency: 1800 watt.
    • Cutting tool: 2” diamond disk.

    Wire bonder-Base 64000G5.

    64000.png Machine serves for forming of IC integral connection with thin aluminum wire by ultrasonic welding in wedge-wedge mode.
    Performance capability:

  • Level of automation – automaton.
  • Wire diameter: 17…50 µm.
  • Work field: 250х150 mm.
  • The automatic and semi-auto Wedge/Wedge Bonder 5630.

    5630.png Machine serves for forming of IC integral connection with thin aluminum/gold wire by ultrasonic and thermosonic welding in wedge-wedge mode; for weld strength control through liftoff.
    Performance capability:

  • Level of automation – semiautomated machine.
  • Wire diameter: 17…75 µm.
  • Work field: 100х100 mm.
  • Worktable temperature – up to 2000С.
  • Line of IC packages sealing in inert ambient through seam welding with integrated vacuum furnace HPS9206M.

    9206.png Machine serves for rectangular packages bonding in inert ambient though electrocontact seam welding with thermo vacuum pretreatment.
    Performance capability:

  • Total area of vacuum furnace pallets: 0,64 sq.m.
  • Furnace temperature range – 50…3500С.
  • Vacuum level – up to 10-2 millimetre of mercury.
  • Furnace performance capacity: up to 400 items with 30х30х5 mm size per 48 hours (unit process).
  • Welding operator work field size: 200х200 mm.
  • Level of automation – semiautomated machine.